| 摘要 |
PURPOSE:To provide a method for manufacturing a wiring board free of interlayer peeling between solder resist and prepreg. CONSTITUTION:A method for manufacturing a title wiring board where a wiring pattern is formed over the surface of an insulative base material 9 and printed with a solder resist; then, the insulative base material 9 is piled up via prepregs. After wiring patterns 51, 52 are formed over the surface of the insulative base material 9, a mask screen 3 which masks the wiring pattern part is used to make mask printing where a solder resist is printed up to almost the same height as that of the wiring pattern in a gap 50 between the wiring patterns 51, 52. Thereafter, whole face printing is made where the whole face is coated with a solder resist. |
