| 摘要 |
PURPOSE:To provide a forming method at low cost with a simple means for a pin hold part for holding a pin of a lead frame firmly, a leakage-preventive part for preventing a leakage surely in a resin molding step, and a heat sink fixing part for fixing a heat sink of an IC firmly. CONSTITUTION:A sheet-shaped base material made of a thermohardening resin, which is the same material as used in a resin mold, is punched into a given shape to make thin-plate members for a pin hold part, a resin leakage-preventive part, and a heat sink fixing part. Then, the thin-plate members are pressed with heat and welded to a given place of a lead frame 2 while a surface of an inner pin 3 or an outer pin 4 is firmly covered and spaces 6 and 7 between pins are filled with resin materials of these thin-plate members. After that, the resin materials are hardened to form a pin hold part 8, a resin leakage- preventive part 11, and a heat sink fixing part. |
