| 摘要 |
A water cooled heat sink particularly for use with traction power semiconductor comprises a plate like body having channels in both faces separated by a central partition but forming a common circulatory channel. The channels are of spiral form the walls separating adjacent channels providing a support for a 'lid' which is sealed to each face. Water is then pumped through the channels, in contact with the 'lids' from an inlet to an outlet port. The 'lids' are formed by composite tiles, each consisting of a wafer of ceramic of good thermal conductivity, having on both sides a layer of copper intimately bonded to it. Maximum heat transference ability is achieved by the thin-ness of the tile and the channel structure, while maintaining the necessary electrical insulation. <IMAGE> |
