发明名称 |
Pin grid array package with pin through plating |
摘要 |
The present invention provides a method and an apparatus for manufacturing a pin grid array package assembly. According to this invention, the leads of the pin grid array package assembly are removably inserted into an electrically conductive plate containing detachable pin-clasp contacts. The plate clamps onto the ends of the leads, thereby forming a common electrical contact for the electroplating process. After the electroplating process has been completed and prior to shipping the package, the plate is detached without requiring the step of cutting ends of the leads from the plate. |
申请公布号 |
US5342992(A) |
申请公布日期 |
1994.08.30 |
申请号 |
US19910775230 |
申请日期 |
1991.10.11 |
申请人 |
KYOCERA INTERNATINOAL, INC. |
发明人 |
NOTO, KAZUYOSHI |
分类号 |
H01L21/48;H01L23/498;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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