Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure.

摘要

The heat sink structure of a module substrate includes a plurality of stripe-like bottom regions (70) extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions (72) extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins (71).