发明名称 AUTOMATIC SOLDERING APPARATUS, TEACHING APPARATUS THEREOF AND TEACHING METHOD THEREOF, SOLDERING INSPECTION APPARATUS AND ITS INSPECTION METHOD, AND AUTOMATIC SOLDERING CORRECTION APPARATUS AND ITS CORRECTION METHOD.
摘要 <p>A soldering-part kind table (26) contains beforehand the information on soldering conditions such as the position and the angle of a soldering iron, the amount of solder fed, and heating time, for each soldered part. In a floppy disc of a floppy disc apparatus (24), stored is beforehand the information on the parts to be mounted on a board corresponding to the board ID. When the board ID is inputted, the parts to be mounted on the board are displayed on a display apparatus (23). The operator causes the sort table (26) of the parts for soldering to be displayed, and specifies the information on the soldering conditions corresponding to the part group to which the displayed parts belong. Thereby, created is a teaching data table (27) containing the information on the soldering conditions of the parts. According to the table (27) the parts are automatically soldered. <IMAGE></p>
申请公布号 EP0612203(A1) 申请公布日期 1994.08.24
申请号 EP19920922995 申请日期 1992.11.09
申请人 OMRON CORPORATION 发明人 KOBAYASHI, SHIGEKI, OMRON INST. OF LIFE SCIENCE;YAMAMOTO, NORIHITO, OMRON INST. OF LIFE SCIENCE
分类号 B23K1/00;B23K3/03;B23K3/08;B25J9/16;G05B19/418;H05K13/04;H05K13/08;(IPC1-7):H05K3/34 主分类号 B23K1/00
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