发明名称 Crystallized semiconductor layer, semiconductor device using the same and process for their fabrication.
摘要 <p>Method of fabricating semiconductor devices such as thin- film transistors by annealing a substantially amorphous silicon film at a temperature either lower than normal crystallization temperature of amorphous silicon or lower than the glass transition point of the substrate so as to crystallize the silicon film. Islands, stripes, lines, or dots of nickel, iron, cobalt, or platinum, silicide, acetate, or nitrate of nickel, iron, cobalt, or platinum, film containing various salts, particles, or clusters containing at least one of nickel, iron, cobalt, and platinum are used as starting materials for crystallization. These materials are formed on or under the amorphous silicon film.</p>
申请公布号 EP0612102(A2) 申请公布日期 1994.08.24
申请号 EP19940301075 申请日期 1994.02.15
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI, SHUNPEI;TAKEMURA, YASUHIKO;ZHANG, HONGYONG;TAKAYAMA, TORU;UOCHI, HIDEKI
分类号 H01L29/78;H01L21/20;H01L21/336;H01L21/77;H01L21/84;H01L29/786;(IPC1-7):H01L21/20 主分类号 H01L29/78
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