Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels

摘要

A method of attaching a heat sink to a circuit board for cooling an electrical device mounting system employing a plurality of heat conductive layers embedded in a printed circuit board where heat conduction therebetween is facilitated by a plurality of heat conduction channels passing through one layer to another where the heat generated by the semiconductor device is conducted into the conducting layers via the heat conduction channels and into a heat dissipation device, such as an aluminum heat sink.