发明名称 WIRING BOARD BORING METHOD AND BORER
摘要 PURPOSE:To enhance an inner circuit and a hole in position accuracy by a method wherein a guide hole which indicates the position of the inner circuit is bored in a multilayer wiring board, the multilayer wiring board is fixed to a numerical control borer, and the position of the guide hole is measured and corrected, comparing it with a design value. CONSTITUTION:A guide hole 4 is provided at a guide mark position 3 located at each corner of the inner circuit 1 of a multilayer wiring board 2 with an X-ray guide hole borer. Then, the multilayer wiring board 2 is fixed to a numerical control biaxial borer. A CCD camera is moved over the guide hole 4 of the multilayer wiring board 2 by the X-axis movement device and the Y-axis movement device of the borer, the position coordinates of the guide hole 4 measured by the frequency function of the X-axis movement device and the Y-axis movement device and the design value of the guide hole 4 are compared with each other by a computer, and when it is found that a difference between them is smaller than a specific value, a boring operation is carried out, and when a difference is larger than a specific value, a boring operation is not carried out. Moreover, it is automatically judged by a computer that a boring operation is carried out or not, and a judgment is automatically transferred to a numerical control borer controller.
申请公布号 JPH06232564(A) 申请公布日期 1994.08.19
申请号 JP19930020031 申请日期 1993.02.08
申请人 HITACHI CHEM CO LTD 发明人 NIRASAWA JUN;OGINO HARUO
分类号 B23B41/00;B26F1/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 B23B41/00
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