| 摘要 |
PURPOSE:To uniformly add a specified amount of additive to solder material for bonding a semiconductor chip to a die bonding substrate. CONSTITUTION:Out of two planar solder materials 1a and 1b, one solder material 1a is sent at a constant speed, and a specified amount of additive 5 having a constant grain diameter is sprayed on the upper surface of the solder material 1a. The other solder material 1b is laminated on the upper surface of the one solder material 1a. Two sheets of the solder materials 1a and 1b are stuck in a unified body while being rolled by a roller 2. A planar solder material 3 formed by sticking is cut into a strip-form. Its belt type solder material 3a is rolled up by a reel 4, and supplied as die bonding material capable of die bonding. Thereby the difference of solder thickness just under a die-bonded pellet is reduced, and erroneous recognition of a semiconductor chip at the time of wire bonding can be reduced. |
