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发明名称
METHOD OF FORMING ALUMINUM INTERCONNECTION
摘要
申请公布号
JPH06232273(A)
申请公布日期
1994.08.19
申请号
JP19930016470
申请日期
1993.02.03
申请人
SONY CORP
发明人
TAGUCHI MITSURU
分类号
H01L23/52;H01L21/3205;H01L21/768;(IPC1-7):H01L21/90;H01L21/320
主分类号
H01L23/52
代理机构
代理人
主权项
地址
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