| 摘要 |
PURPOSE:To freely adjust the spot diameter of a laser beam on the surface of the material to be processed. CONSTITUTION:A semiconductor laser unit is provided on a semiconductor laser processing device, and the semiconductor laser unit is composed of a light-emitting unit A and a light condensing unit B. The light-emitting unit A is mainly composed of an array semiconductor laser 1 and a solid laser element 4, and the light condensing unit is mainly composed of a light-condensing lens 10 and a lens-moving means 11 with which the lens 10 is moved to the direction of light axis. A plurality of laser beams, emitted from the array semiconductor laser 1 are put together and are received by a solid laser element 4, and the high output parallel beam emitted from the solid laser element 4 is focused by the condensing lens 10, and it is made to irradiate on the printed substrate 30 on an X-Y table 22. By the vertical movement of the condensing lens 10 by the lens moving means 11, the spot diameter on the surface of a printed substrate 30 is optimum-adjusted in accordance with the type of processing and the configuration and the like of objective of processing, and the processing operation can be conducted in an efficient and highly precise manner. |
