| 摘要 |
PURPOSE:To enable a void-free organic thin film to be formed flat and uniform in quality without causing damage to its surface by a method wherein a board on which resin varnish is applied is heated in a solvent-saturated atmosphere to make its surface even, and then solvent vapor is discharged out to cure resin by drying. CONSTITUTION:A rugged board 3 on which resin varnish 1 is applied is heated in a saturated atmosphere or a nearly saturated atmosphere 5 of varnish component solvent vapor. Therefore, solvent vapor contained in an atmosphere and solvent contained in a varnish coating are approximately in an equilibrium at the surface of a varnish coating, solvent is restrained from evaporating from a varnish coating, so that the surface of a varnish coating is kept wet with solvent. That is, even a very rugged surface can be flattened enough through this method, and a void-free organic coating film can be obtained. After a flattening process is finished, the organic coating film is cured by drying in the same vessel 4 as a flattening process by discharging solvent vapor out of the vessel 4. |
