| 摘要 |
PURPOSE:To enable manufacture of a light-emitting diode of which the luminous intensity is not lowered by electrification even in an atmosphere of high temperature, by executing resin sealing immediately after a lead frame part including a light-emitting diode and a wire is immersed in a specific solution. CONSTITUTION:Since viscosity is so low as 100cps or below, only a fore end part being extreme in such a degree that the inside of a reflective cup 8 out of the opposite bonded sides of lead frames 2a and 2b subjected to die-bonding and wire-bonding submerges entirely in a solution 5 can be pre-dipped with increased stability without entangling bubbles in. Thereafter the reflective cup 8 is taken out and inserted promptly into light-transmitting liquid epoxy resin injected and filled in a sealing mold 6 beforehand, so that a larger area thereof than the part wetted with the solution 5 in the preceding process comes into contact with the resin, and then it is set by heating to be sealed with the resin. Since a protective film for a light-emitting diode is formed and besides no expansion difference occurs between the protective film and the sealing resin, consequently, a mechanical impairment is prevented. |
