| 摘要 |
PURPOSE:To prevent trouble such as chipping of a semiconductor wafer held by a carrier between upper and lower disks when polished on both sides by holding the wafer in a hole in the carrier, together with the second annular carrier. CONSTITUTION:Semiconductor wafers 3 held in holes 7A... in a carrier 7 are laid between upper and lower disks 1, 2 mutually reverse-turned. The carrier 7 is autorotated and revolved in accordance with a difference in rotating number between a sun vehicle 5 and an internal gear 6, and the wafers 3 are autorotated in the holes 7A to be polished on both sides. In such a polishing method, each wafer 3 is borne by the second annular carrier 8 and stored in the hole 7A in the carrier 7. The annular carrier 8 is thus functioned as a shock absorber during the autorotation of the wafer 3 to absorb shock applied from the hole 7A in the carrier 7 to the wafer 3 so that the wafer 3 is prevented from chipping when polished. |
