| 摘要 |
PURPOSE: To provide a surface mounting type package, equipped with a specific number or less of I/O connecting terminals in which thermal radiativity and conductivity are reinforced, while maintaining flexibility and convenience of a conventional lead frame. CONSTITUTION: A packet includes a conductive substrate 22 with a cavity for inserting an integrated circuit die 34, equipped with plural bonding pads and a flexible circuit 4 layered on the conductive substrate 22. This includes a wiring pattern 28 and a region array 18 of bumps 8 formed on pads 30 on the surface of a circuit 4. Also, this includes plural opening 33 grounding passing through the circuit 4 at the lower part of the pads 30 and a trace 11 of the wiring pattern to the substrate 22. Conductive adhesive 24 for facilitating the electric connection of the ground pads for inserting the opening 33 into the substrate 22 is used for the lamination of the circuit 4 on the substrate 22. |
