| 摘要 |
PURPOSE:To provide a method and an apparatus for automatically and accurately detecting a cutting line of a semiconductor wafer and cutting the wafer. CONSTITUTION:A method for dicing a semiconductor wafer comprises the steps of imaging the wafer 11 by a CCD camera 22, processing its image information to a computer 21, etc., to detect a position of a cutting line, and cutting the wafer based on positional information of the line. Particularly, before the wafer is cut, positions of all the lines are detected, and the steps are simplified. Further, in order to reduce influence of positional deviation of the wafer due to cutting as much as position, the position of the line of a first direction is detected and cut, then the position of the line of a second direction is detected and cut. |
