| 摘要 |
PURPOSE:To improve operation yield of a semiconductor chip mounted inside. CONSTITUTION:A ground potential pattern 3 in a semiconductor device package is die-bonded with a semiconductor chip 4 comprising a transistor circuit and are connected electrically through a via hole. Thereby, a thin film resistance 6 is also provided for a die area 5 in the package having a source voltage pattern. This thin film resistor 6 is used as a source resistance of the transistor circuit. |
