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发明名称
METHOD OF FORMING SOLDER BUMP
摘要
申请公布号
JPH06224201(A)
申请公布日期
1994.08.12
申请号
JP19930031385
申请日期
1993.01.27
申请人
KURODA DENKI KK
发明人
GONDA MAKOTO
分类号
H01L21/60;H05K3/34;(IPC1-7):H01L21/321
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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