Klebstoff für Halbleiterelemente und damit hergestellte Gegenstände.
摘要
An adhesive for bonding a semiconductor pellet to an attachment site where the adhesive is an addition reaction-curing silicone rubber composition which contain </= 500 ppm of low-molecular-weight siloxane which has a vapor pressure >/= 10 mmHg at 200 DEG C.
