| 摘要 |
<p>PURPOSE:To make retaping possible for electronic parts with short lead wires by a method wherein an element part of a separated tape piece-attached electronic part is held, and the tape piece is extracted and removed along a lead wire of a lead-attached electronic part with the tape piece engaged, and retaping is applied to the electronic part with short lead wire wherefrom the tape piece is removed. CONSTITUTION:A separating device 10 is provided for separating electronic parts 1 into individual pieces with a tape 3 applied for taping lead wires 2 of the electronic part 1 cut. A conveyance device 90 that conveys the separated electronic parts 1 and a tape piece removing device 100 for removing the tape pieces cut by the separating device 10 provided in the conveyance passage of the conveyance device 90 are also provided. The title apparatus is also constructed of a transfer device 150 that transfers the electronic parts 1 wherefrom the tape pieces are removed to a position for holding pieces in the conveyance device 90 and a retaping device 160 that applies retaping to the electronic parts 1. Thereby, retaping can be applied to the electronic parts with short lead wires because the lead wires are not cut.</p> |
