| 摘要 |
PURPOSE:To provide a component mounter which an improve the processing cycle time of mounting and is excellent in reliability of testing lead bends of electronic components. CONSTITUTION:A camera 22, provided at stopping point C of a component- sucking nozzle between a component suction part 11 and a component mounting part 15, picks up leads projecting out of two nearly parallel sides of an electronic component and makes the electronic component rotate by 90 deg. at the next nozzle stopping point D; further, a camera 22 provided at the next nozzle stopping point E picks up leads projecting out of the two other parallel sides the electronic component, and a controller discriminates conditions of lead bend of the electronic component by entry of picked up image from both cameras 22. This enables test of conditions of lead bend of an electronic component without the rise/fall actions of a nozzle, thereby improving mounting tact. |
