| 摘要 |
<p>The fluorescent display device allows mounting of a semiconductor (30) on a substrate (20), while providing an increase in resistance to moisture, a reduction of the contact resistance in the connection between the semiconductor (30) and an electrical conductor (21), as well as obtaining increased reliability. A semiconductor element (30) is mounted on an extension (20a) of a substrate (20), and is housed in a mounting chamber (34) formed by the interaction of a sealing material (33), of a front plate (32) and of the substrate (20). The semiconductor element (30) is pushed downwards, against the substrate (20), by the front plate (32), thus producing an electrical connection between the semiconductor element (30) and an electrical conductor (21). <IMAGE></p> |
