| 摘要 |
<p>PURPOSE:To provide a method for effectively taking out a semiconductor device by deciding the device to be taken out based on MAP information obtained in an inspecting step. CONSTITUTION:The method for taking out a semiconductor device comprises the steps of deciding a semiconductor device 3 to be taken out by using MAP information regarding a non-defective product or a defective product obtained at the time of measuring characteristics of the device 3, deciding a position of a monitor chip 2 formed as a pair with the device 3 to be taken out, deciding a position of the device to be taken out based on a position of the chip 2, and taking out the device from a board.</p> |
