| 摘要 |
<p>PURPOSE:To suck and move an IC chip with a collet without causing damages or cracks in the surface protective film of the IC chip by providing an air inlet port at the side surface of the collet. CONSTITUTION:When a collet 2 is driven with a driving device and a protruding part 4b of the side surface having an air inlet port 4a comes into contact with the side surface of an IC chip 3, a side surface 3a of the IC chip 3 is sucked with a sucking device through the air inlet port 4a and attracted to the air inlet port 4a. When the side surface 3a of the IC chip 3 is attracted to the collet 2, the driving device drives the collet 2 again, and the IC chip 3 is moved to a semiconductor-chip attaching part such as a die pad of a lead frame. Thus, the occurrences of damages or cracks on the protective film of the semiconductor chip during the movement of the semiconductor chip caused by the collet can be prevented.</p> |
