| 摘要 |
PURPOSE:To produce a black matrix substrate having high dimensional accuracy and high light shielding property by electroless plating at low cost by forming a relief image essentially consisting of a hydrophilic resin and having a pattern for the black matrix and specified or higher swelling rate. CONSTITUTION:A photosensitive resist layer 3 is formed on a transparent substrate 13 by applying a photosensitive resist containing a hydrophilic resin. Then the photosensitive resist layer 3 is exposed to light through a photomask 9 for the black matrix and developed to form a relief image 4 having a pattern for the black matrix. This relief image 4 essentially consists of a hydrophilic resin and has >=0.8 swelling rate. When an electroless plating liquid is brought into contact with this relief image 4, the electroless plating liquid uniformly permeates through the relief image 4 to increase deposition of metal fine particles. Thus, metal particles can be deposited almost uniformly on the whole relief. |
