| 摘要 |
<p>A mounting assembly for power semiconductors comprises a plurality of modules (20) arranged in a symmetrical arrangement around a central axis. Each module has one or more heat sink substrate surfaces (201, 203) for the mounting of semiconductor components (205) and an internal passage (202) for passing a fluid cooling medium therethrough in order to cool the semiconductor components. The assembly may comprise a prismatic body (24) providing the substrate surfaces (243).</p> |
