发明名称 PARTIALLY PLATING METHOD FOR MOLDED PRODUCT OF RESIN
摘要 <p>PURPOSE:To manufacture a cmposite molded product of resins which has no thin stripes at the border between the resins, and has large difference in sensibility to plating, by molding the ABS resin with high impact styrene resin (HI resin) in such a manner that the ABS resin comes to the surface. CONSTITUTION:An HI resin such as a copolymer etc. which is made by the graft polymerization of styrene monomer with butadiene-styrene comonomer, and ABS resin are molded in the following way: The HI resin and ABS resin are molded using an injection molding machine for double molding, e.g., a multiple color, simultaneous molding machine, or a usual injection molding machine to form a composite molded resin in which ABS resin comes to the surface at portions which are to be plated partially. Then the composite molded resin is pretreated especially with high- chromium etching soln., then subjected to electroless plateing, electolytic plating by usual method to conduct partial plating.</p>
申请公布号 JPS5547376(A) 申请公布日期 1980.04.03
申请号 JP19780118942 申请日期 1978.09.27
申请人 TOYO TERUMII KK 发明人 OOWADA TAKAO
分类号 C23C18/16;C23C18/20;C23C18/31;C23C18/40;C25D5/56 主分类号 C23C18/16
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