发明名称 Machining error correction apparatus.
摘要 <p>The diameter, the orientation flat width / notch depth and the length of the block 10p of a semiconductor ingot are measured by the measuring devices 71a, 71b and 71c respectively and then the machining errors DELTA Dp, DELTA Wp and DELTA Lp in the measured values against the set values are calculated at the error calculation unit 833. Then DELTA Dp, DELTA Wp and DELTA Lp are stored in memory at the memory unit 834 in correspondence with the identification codes IDi and IDj of the grinding device 5i (i=1 - N) and the cutting device 6j (j =1 - M) that performed the machining. Then at the average value calculation unit 835, the average values of DELTA Dp and DELTA Wp for each of the grinding devices 51 - 5N and the average value of the DELTA Lp for each of the cutting devices 61 - 6M are calculated. The average values of DELTA Dp and DELTA Wp are supplied to the corresponding grinding device 5i as the diameter correction value and the width/depth correction value respectively and the average value of DELTA Lp is sent to the corresponding cutting device 6j as the length correction value from the transmission unit 836. <IMAGE></p>
申请公布号 EP0608890(A1) 申请公布日期 1994.08.03
申请号 EP19940101243 申请日期 1994.01.28
申请人 SHIN-ETSU HANDOTAI COMPANY LIMITED 发明人 HIRANO, YOSHISIRO, C/O ISOBE PLANT SHIN-ETSU;OZAKI, ATSUSHI, C/O ISOBE PLANT SHIN-ETSU
分类号 B23Q15/04;B24B49/02;B24B49/03;C30B33/00;G05B19/401;G05B19/418;H01L21/304;(IPC1-7):B24B49/02 主分类号 B23Q15/04
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