发明名称 PLATING METHOD
摘要 PURPOSE:To control the plating area and plating thickness at an irreducible minimum of a demand, by spraying a plating fluid to the surface to be plated with the inside of a mask which is in contact with the surface kept a reduced press. in order to suck and recover the plating fluid forcedly by the negative press. CONSTITUTION:A plating fluid is charged to a mask holder 2 which is pressed to the plating surface of a material W to be plated, and is sprayed through a nozzle 5 to the surface at a high press. for a prescribed time. The inside of the holder 2 is controlled at a suitable negative press. by means of a press. control valve 3, so that an unnecessary portion of the sprayed plating fluid is sucked and recovered quickly by a suction means 4 such as a vacuum pump. Hence, sufficient amount of the plating fluid is charged at need to the surface to be plated for a very short time. Hereby, fresh plating fluid only is charged continuously to the plating surface, so that the concn. of the metallic ions taking part in the plating is kept constant. In the figure, a numeral 6 shows a separating, means for a gas-fluid mixt. discharged from the holder.
申请公布号 JPS5547377(A) 申请公布日期 1980.04.03
申请号 JP19780119082 申请日期 1978.09.29
申请人 ADACHI SEIYA 发明人 ADACHI SEIYA
分类号 C23C4/12 主分类号 C23C4/12
代理机构 代理人
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