| 摘要 |
PURPOSE:To provide a resin sealing mold and the resin sealing method for a semiconductor device improved in a manner of not generating the stay shift on a lead frame by resin pressure at the time of injecting resin into a cavity of mold in the resin sealing process for-the semiconductor device. CONSTITUTION:Clamping means 38 and 40 for clamping die pad hanging sections 82 and 84 of a lead frame 72 are provided in a mold 10. The clamping means 38 is composed of a clamping section 24 with a butt face 25 of a top force 12 extended and protruded into a cavity 36 and a clamping section 32 with a butt face 27 of a bottom force 14 extended and protruded into the cavity 36 and forming a couple with the clamping section 24 and facing the same. The clamping means 40 is composed in the similar manner. At the time of mold opening of the mold 10, the die pad hanging sections 82 and 84 are clamped respectively between the clamping sections of the clamping means 38 and 40 so that a semiconductor device is not tilted by resin pressure in the cavity 26. |
