| 摘要 |
PURPOSE:To shorten exchanging time taken for changing type of a resin seal type semiconductor device, in a transfer molding technique. CONSTITUTION:In a transfer molding method, each pot 311, of a mold 3 and a size of each tablet to be put in the pots 311 are standardized. The size of each cavity 314 is changed in accordance with change of type of a resin seal type semiconductor device. In the mold 3, one cavity 314 is filled with resin coming from a plurality of pots 311. |
