发明名称 MANUFACTURE OF BOARD LIKE MATERIAL EQUIPPED WITH RESIN FRAME
摘要 PURPOSE:To enable a resin frame material to be strongly bonded to a board like material by a method wherein a peripheral fringe part of the board composed of a glass plate or the like with which the resin frame material is integrally molded is coated with a primer having a specific composition and dried. CONSTITUTION:A resin frame material 2 is molded integrally with a peripheral fringe part of a board like material 5 by injecting non-poly (vinyl chloride) resin soft thermoplastic resin into a metal mold cavity 10 from an injection molding machine 1 after pinching the board like material 5 of a glass plate or the like between upper and lower metal molds 3, 4 for resin molding. In that case, the peripheral fringe part of the board like material 5 with which a resin frame 2 is molded integrally, is coated with a primer having a specific composition, and dried. Then, the primer is composed of A) either of organic solvent solution of polypropylene polymer modified with unsaturated carboxylic acid or its derivative and chlorine, or organic solvent dispersion material of modified polypropylene polymer, B) solution of polyurethane resin, and C) an adhesive additive.
申请公布号 JPH06206237(A) 申请公布日期 1994.07.26
申请号 JP19930019732 申请日期 1993.01.12
申请人 MITSUI PETROCHEM IND LTD;ASAHI GLASS CO LTD 发明人 YOSHIHARA NORIYUKI;TAKAHASHI KAZUHIRO;WATANABE HIROYUKI;ENOSHITA TOKUYUKI;UCHIYAMA AKIRA
分类号 B29C45/14;B29L31/30;B60J1/00;(IPC1-7):B29C45/14 主分类号 B29C45/14
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