| 摘要 |
PURPOSE:To enable the heat released from a high power transistor equipped with a heat dissipating plate to be efficiently dissipated. CONSTITUTION:A transistor of high power is forcibly cooled down by circulating cooling fluid 8 inside a hollow Al heat sink 7 to absorb heat energy which is released from the transistor and reaches to solder materials 5. By this setup, thermal stress imposed on solder material can be relaxed, whereby solder material can be elongated in service life shortened by thermal fatigue. |
