| 摘要 |
PURPOSE:To provide a manufacturing method which forms an electric conductor member designed to connect an electric circuit component to a circuit board with a specified amount of projection and shape more simply and a connection method between the circuit board and the electric circuit component. CONSTITUTION:The manufacturing method of a circuit board 101 provides a process which installs a second insulation material at least to one partial area of the surface of a first electric insulation material with a definite film thickness and a process which bores a plurality of holes in a specified area of the second electric insulation material and partially exposes circuit patterns 102 and 103 installed on the surface of the first electric insulation material. Furthermore, this manufacturing method provides at least a process which fills an electric conductor material in the hole flush with the surface of the electric insulation material or in a projecting manner and a process which eutectoid-forms an adhesive resin layer on the surface of the electric conductor member from an adhesive resin solution based on an electro phoretic method. |
