| 摘要 |
PURPOSE:To enhance a semiconductor device in manufacturing yield and reliability by a method wherein a short circuit is prevented from occurring between a heat dissipating pedestal and a wire due to the wire in hanging, and a bare chip is enhanced in accuracy of mounting position. CONSTITUTION:A heat releasing pedestal 2 is of such a rotation-symmetrical structure that first slopes 2b are provided between a bare chip mounting face 2a and side faces 2e of a heat dissipating pedestal 2, a second slope 2c is provided between the adjacent first slopes 2b, a second side face 2d is provided between the adjacent side faces 2e, the heat dissipating pedestal 2 is mounted on a pedestal mounting electrode 5 on a hybrid substrate of thick film, and a chip transistor 1 mounted on the bare chip mounting face 2a is connected to a wire connection electrode 4 with a wire 3. |
