| 摘要 |
PURPOSE: To provide a method of forming a metal interconnection pattern improving productivity. CONSTITUTION: A method, through which a metal interconnection pattern 100 is formed for an integrated circuit module 90, comprises a first process where only the surface 110 of the module 90 is aligned, a second process where a metal layer is formed on the other surface 120 of the module 90, a third process where the metal layer is coated with a photoresist, a fourth process where a prescribed part of photoresist applied to the metal layer is exposed to reflected radiation, and a fifth process where the metal layer is shaped in accordance with the exposed part of the photoresist. |
