发明名称 PRINTED-CIRCUIT BOARD CONNECTING STRUCTURE
摘要 PURPOSE:To mutually layer printed-circuit boards even in the state where the arrangement space height for board and mounted part has no tolerance to allow the connection, and reduce the number of processes by superposing the end parts of boards, and inserting and connecting the boards to a connector. CONSTITUTION:In the state 109 where the arrangement parts 105, 106 of electrode pads 206 of an inflexible board 104 and a flexible board 104 are mutually superposed, the boards 104, 103 are inserted to the board insert hole 102 of a connector 101, and the connection of the boards 104 and 103 is conducted through the metal terminal having spring property of the connector 101 or by the mutual contact between the electrode pads 206. According to this constitution, even in the stare where the arrangement space height for the boards 104, 103 and mounted parts such as IC 107, 107 has not tolerance, a plurality of boards can be mutually layered and connected. Since this connection does not require a process of soldering, the number of processes can be reduced to reduce the cost.
申请公布号 JPH06203932(A) 申请公布日期 1994.07.22
申请号 JP19920348853 申请日期 1992.12.28
申请人 SEIKO EPSON CORP 发明人 KINOSHITA YOSHIKI
分类号 H05K3/32;H05K3/36 主分类号 H05K3/32
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