Method for forming via holes in multilayer circuits.
摘要
The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.
申请公布号
EP0606645(A1)
申请公布日期
1994.07.20
申请号
EP19930120950
申请日期
1993.12.27
申请人
E.I. DU PONT DE NEMOURS AND COMPANY
发明人
DORFMAN, JAY ROBERT;LANTZER, THOMAS DAVID;SUTTON, DAVID LEROY;DRAUDT, RICHARD RAYMOND;MONES, ARTHUR HARVEY
