| 摘要 |
A multi-coplanar, multi-layer capacitor array for use as an RFI filter associated with an electrical connector module having a pattern of pin and socket connections includes a multi-layer board structure of super imposed layers including ground plane layers and capacitor layers interleaved with one another. An array of apertures extend vertically through each of the layers forming a grid having a center-to-center spacing and pattern congruent with the apertures in the desired connector module and are configured to receive the conductor pins. The ground plane layers include a continuous conductive layer on top of a dielectric layer with clearance holes surrounding the apertures so as to be electrically insulated from the connector pins and the capacitors. The capacitor plane layers further include a plurality of defined coplanar individual separate capacitor areas encompassing a plurality of terminal pins but connected to one, the rest being provided with clearance holes, thereby associating each pin with an unique capacitive plane. The separate capacitors provide RFI filtering for the signals on each pin.
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