发明名称 |
Process for exposing a photosensitive resin composition to light |
摘要 |
The present invention provides an improved process by which dissolved oxygen is effectively removed from a photosensitive resin layer of a photosensitive resin plate. The process comprises preliminarily exposing the photosensitive resin to light to quench oxygen dissolved in said photosensitive resin layer before conducting a main exposure. The photosensitive resin layer is prepared from a photosensitive resin composition which comprises: (a) a polymer binder, (b) a radically polymerizable monomer, (c) a sensitizing dye, and (d) a photopolymerization initiator which is excited by a light of a different wave length from a light exciting the sensitizing dye. The preliminary exposure is conducted with a light only exciting the sensitizing dye and the main exposure is conducted with a light exciting the photopolymerization initiator.
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申请公布号 |
US5330882(A) |
申请公布日期 |
1994.07.19 |
申请号 |
US19910709964 |
申请日期 |
1991.06.04 |
申请人 |
NIPPON PAINT CO., LTD. |
发明人 |
KAWAGUCHI, CHITOSHI;ARIMATSU, SEIJI;KONISHI, KATSUJI;KANDA, KAZUNORI |
分类号 |
G03F7/20;(IPC1-7):G03C5/00 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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