发明名称 |
Method of manufacturing electronic device |
摘要 |
An electronic device comprises a housing made of a polycarbonate resin, and a novel double-sided printed circuit board. The printed circuit board has one side embedded in the housing, and the other side exposed to the interior of the housing. A plurality of refractory electronic components are mounted onto one side of the printed circuit board and include a resistor and a capacitor. A plurality of lower refractory electronic components are mounted onto the other side of the housing and include a semiconductor integrated circuit, and a transformer. Preferably, an insulating layer is applied to cover the one side of the printed circuit board and the refractory electronic components. Also, a metal layer is applied to cover the insulating layer and the inner surface of the housing.
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申请公布号 |
US5329696(A) |
申请公布日期 |
1994.07.19 |
申请号 |
US19920900121 |
申请日期 |
1992.06.18 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MORITA, TAKESHI;HAYASHI, OSAMU |
分类号 |
H05K1/18;B29C33/14;B29C45/14;B29C70/68;H05K3/00;H05K3/28;H05K7/14;(IPC1-7):H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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