发明名称 |
Electronic equipment and computer with heat pipe |
摘要 |
An electronic equipment has heat pipes for radiating heat generated from heat generating electronic parts. The electronic parts are arranged such that electronic parts generating more heat are arranged nearer to a heat radiating portion of each heat pipe to prevent a phenomenon of dryout and radiate the heat efficiently, whereby heat generated from the electronic parts such as LSI chips can be effectively radiated and an excessive rise in temperature of the electronic parts can be suppressed. When the invention is applied to computers, the entire computer size can be reduced.
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申请公布号 |
US5331510(A) |
申请公布日期 |
1994.07.19 |
申请号 |
US19920936299 |
申请日期 |
1992.08.28 |
申请人 |
HITACHI, LTD. |
发明人 |
OUCHI, KATSUNORI;MORIHARA, ATSUSHI;NAGANUMA, YOSHIO;SATO, KOJI;KAJI, RYUICHI |
分类号 |
F28D15/02;G06F1/20;H01L23/427;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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