| 摘要 |
<p>PCT No. PCT/EP93/01578 Sec. 371 Date Jan. 12, 1995 Sec. 102(e) Date Jan. 12, 1995 PCT Filed Jun. 19, 1993 PCT Pub. No. WO94/03927 PCT Pub. Date Feb. 17, 1994The invention relates to an arrangement for a preassembled structure of disc cell semiconductors that can be pressure-contacted, in which a loose, stacked module comprising disc cell semiconductors, associated terminal tags and end-side cooling cells and insulating cells is held together until final assembly by means of loose fixation via insulating pipes that serve to insulate the studs to be brought in later for pressure-fixation of the module, for which purpose the insulating pipes, each being provided at one end with a flange, engage a common holding plate from behind, and are guided at the other end through a common insulator, via which axial securing of the module is effected through frictional-lockup connection to the insulating pipes by means of a tightening strap. To achieve improved fixation and axial securing of the components against falling apart, it is proposed in accordance with the invention that the holding plate (3) and the insulator (2) are guided axially movably via the insulating pipes (13), wherein the holding plate (3) is supported against the flanges (13a) of the insulating pipes (13) via spring elements (18), and a frictional-lockup element to the insulating pipes (13) is associated with the insulator (2) and permits limited movement in the axial direction.</p> |
