METHOD OF MANUFACTURING THICK FILM CIRCUIT SUBSTRATE,申请号KR19900013393-传众专利搜索

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发明名称	METHOD OF MANUFACTURING THICK FILM CIRCUIT SUBSTRATE
摘要
申请公布号	KR940006222(B1)	申请公布日期	1994.07.13
申请号	KR19900013393	申请日期	1990.08.29
申请人	MATSUSHITA ELECTRIC IND. CO., LTD.	发明人	KUMAGAI, KOICHI;ONISHI, HIROAKI
分类号	H01L27/01;H01C17/22;H01L21/3205;H05K1/02;H05K1/03;H05K1/09;H05K1/16;H05K3/00;H05K3/02;H05K3/08;H05K3/28;H05K3/46;(IPC1-7):H05K3/02;H01L27/00	主分类号	H01L27/01
代理机构		代理人
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