MULTICHIP INTERCONNECT MODULE INCLUDING SUPERCONDUCTIVE MATERIALS

摘要

A multichip interconnect module utilizes superconducting conductors to provide improved speed and reduced power dissipation. In one embodiment, x-direction and y-direction conductor units each comprise a substrate (30, 32) having alternating superconducting conductors (20) and ground plane lines (22), where the ground plane lines (22) are connected by bridge-like interconnects (24), where the x-direction and y-direction conductor units are selectively electrically connected. In another embodiment, a superconducting microstrip arrangement utilizes two or more structures having a substrate (30, 32), ground plane (20), insulator (46) and superconducting conductor stacked structure (22). Selective electrical interconnects (34) are made between the structures.