| 摘要 |
<p>PURPOSE:To provide an IC card having a high reliability with respect to poor appearance and failure with an enhance productivity while preventing whitening and cracking of a card base caused by bending the IC card and separation of a molding resin part of an IC module. CONSTITUTION:An external terminal is provided on one surface of a substrate 5. An IC chip 7 provided on the other surface of the substrate and a pattern layer connected to the IC chip 7 through a wiring part are sealed with a molding resin 10 so that the molding resin 10 is smaller than the periphery of the substrate. An IC module 4 produced in this manner is fitted into a module fitting hole 3 formed in a card base 2. In an IC card 1 obtained by securely bonding an exposed part of the other surface of the substrate 5 of the IC module 4 to the bottom part of the module fitting hole 3 at the parts thereof opposed to each other, a groove 11 along the periphery of the mold resin 10 is provided in the exposed part of the other surface of the substrate 5 of the IC module 4.</p> |
