Smart card mfr. e.g. for credit, debit esp. telephone card

摘要

Adhesive is injected in a recess in the surface of the card before locating an integrated circuit chip module (8) in the recess. An auxiliary plastics foil, applied to the surface of the chip card, has an opening aligned with the recess. The edges of the opening are bent inwards upon insertion of the chip module to provide a lip which prevents ejection of adhesive.Pref. the adhesive is in the form of a cold adhesive ring or comprises a hot adhesive injected into the recess.