| 摘要 |
PURPOSE:To obtain an epoxy resin composition having excellent soldering crack resistance, moisture resistance, moldability and and useful for the sealing of semiconductor, etc., by using a specific epoxy resin, a specific molten mixture and an inorganic filler as essential components. CONSTITUTION:This resin composition contains, as essential components, (A) an epoxy resin containing 50-100wt.% (based on the total epoxy resin) of an epoxy resin of formula I (R1 to R8 are H, halogen or alkyl), (B) a molten mixture produced by heating and melting a flexible phenolic resin hardener of formula II (R is p-xylylene; (n) is 1-5) and/or formula III (R is residue obtained by removing two hydrogen atoms from dicyclopentadiene, terpenes, etc.; (n) is 0-4) and a cure accelerator and (C) preferably 70-90wt.% (based on total composition) of an inorganic filler such as fused silica powder. |
