发明名称 |
Burn-in apparatus and method for semiconductor devices |
摘要 |
A burn-in apparatus used in burn-in tests includes a burn-in test chamber for accommodating a plurality of semiconductor devices to be tested. Also, the burn-in apparatus includes measuring devices for detecting electric characteristics of temperature sensors built in the respective semiconductor devices to individually measure junction temperatures of the semiconductor chips incorporated in the respective semiconductor devices, and laser beam irradiating mechanisms or electric heating members. The laser irradiating mechanisms or the heating members are controlled by control units, based on outputs of the measuring devices. Thus, the junction temperatures are maintained in a set junction temperature range, and the screening accuracy can be improved.
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申请公布号 |
US5327075(A) |
申请公布日期 |
1994.07.05 |
申请号 |
US19920914559 |
申请日期 |
1992.07.17 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HASHINAGA, TATSUYA;NISHIGUCHI, MASANORI |
分类号 |
G01R31/28;G01R31/309;(IPC1-7):G01R31/02 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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